2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

October 2018 (Not Final)   United States

The 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) will be held in United States in October 2018 (Not Final).

The 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) is dedicated to electrical analysis, modeling, design and synthesis of electronic packages, interconnections and systems, including:

  • innovative architectures and new design techniques
  • Emerging and advanced issues
  • Novel CAD  methodologies, concepts,  and algorithms for modeling, simulation and optimization

with a focus on:

  • High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
  • System-level, board-level and on-chip interconnects
  • Multiconductor transmission lines
  • Low power mobile and personal applications
  • Jitter and noise management
  • Memory and DDR interfaces
  • Power integrity and power distribution networks (PDNs)
  • Signal and thermal integrity
  • D interconnects, 3D packages, TSVs and MCMs
  • Electronic packages and microsystems
  • RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches
  • Nano interconnects and nano structures
  • Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows
  • Package-chip co-design
  • Advanced and parallel CAD techniques for signal, power and thermal integrity analysis
  • Macromodeling and model order reduction as it applies to electrical analysis
  • Measurement and data analysis techniques for system-level and on-chip structures
Yes

Important

Please, check the official conference website for possible changes, before you make any traveling arrangements

Prices are for evaluation only.

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