The 36th IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2024) is dedicated to integrated power and ICs, power devices and power packaging.
The 36th IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2024) covers topics such as:
- Processes
Doping Technology, Process Integration, Passivation, Lifetime Control and Crystal Growth - Devices
Device Design, Device Physics, High Power Devices, High Frequency Devices, RF Power Devices, Smart Power Devices, Reliability, Safe-Operating Area and ESD - Materials
GaAs, Si, GaN, SiC and Diamond - Modeling/Simulation: Circuit Simulation, Device, Verification Tools and Layout
- Packaging
Power SiP, Novel Packaging Concepts, Thermal Analysis, Stress and Thermal Management - Power ICs
SOI, Isolation Techniques, Device Technology, Circuit Design, SOA, Energy Capability, ESD, Reliability, Monolithic vs Hybrid and Power SoC - Applications
Computer, Hybrid Vehicles, Motor Drives, Telecom Power and Utility
