ICP 2014 - Packaging Technologies for IC Devices is an Exhibition Featuring Various Products and Technologies for Semiconductors, Sensor Modules and LED Packaging.
ICP 2014 - Packaging Technologies for IC Devices presents products and services such as:
ICP 2014 - Packaging Technologies for IC Devices brings together Sensor Manufacturers, Automotive Electronics Manufacturers, Set Manufacturers (in high-density SMT), Assembly Manufacturers/SATS, MEMS Devices/LED Manufacturers and Semiconductor Manufacturers.