ICP 2014 - Packaging Technologies for IC Devices

ICP 2014 - Packaging Technologies for IC Devices is an Exhibition Featuring Various Products and Technologies for Semiconductors, Sensor Modules and LED Packaging.

Key Topics

• Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices
• Various IC Packages
• Substrate, Materials for Substrate, Various Software
• Substrate Zone
• Analysis / Simulation Software for IC Packaging
• Semiconductor Device Inspection & Testing Zone
• Gathering World`s TOP companies specialised in IC design, assembly and testing services!
• Packaging Materials / Components
• SATS / Contract Design Services Zone
• Plating Materials / Chemicals / Equipment
• Assembly Equipment
• Plating / Etching Zone

Who should Attend

Sensor Manufacturers, Automotive Electronics Manufacturers, Set Manufacturers (in high-density SMT), Assembly Manufacturers/SATS, MEMS Devices/LED Manufacturers and Semiconductor Manufacturers.