ICP - IC Packaging Technology Expo
January 20 - 22, 2010(Ended)
Tokyo Big Sight
Tokyo, Japan
Tokyo, Japan
Japan`s MOST POWERFUL Exhibition specialised in IC Final Manufacturing and Packaging Technology for Sensors, MEMS Devices, Opto Devices, etc.- Semiconductor Manufacturers
- Set Manufacturers (in high-density SMT)
- Assembly Manufacturers/SATS
- MEMS Devices/LED Manufacturers
- Sensor Manufacturers
- Automotive Electronics Manufacturers
For professionals involved with electronics manufacturing.
Venue
Address
3-21-1 Ariake, Koto-ku,
135-0063 ,
Tokyo,
Japan
135-0063 ,
Tokyo,
Japan
Categories
Concurrent events
- INTERNEPCON Japan (INJ) : Electronics Manufacturing & SMT Exhibition
- Int'l Automotive Electronics Technology Expo (CAR-ELE JAPAN)
- Pwb Expo 2010 - Printed Wiring Boards
- ET : ELECTROTEST Japan
- ELE TRADE : International Electronic Components Trade Show
- FOE : Fiber Optics Expo
- International Electronic Components Trade Show
- Electrotest Japan
- Internepcon Japan
- Ele Trade
Important
Please, check the conference website for possible changes, before you make any traveling
arrangements
* Prices are for evaluation only.
