35th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2026)

The 35th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2026) is dedicated to electrical analysis, modeling, design and synthesis of electronic packages, interconnections and systems, including:

• innovative architectures and new design techniques
• Emerging and advanced issues
• Novel CAD methodologies, concepts, and algorithms for modeling, simulation and optimization

with a focus on:

• High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
• System-level, board-level and on-chip interconnects
• Multiconductor transmission lines
• Low power mobile and personal applications
• Jitter and noise management
• Memory and DDR interfaces
• Power integrity and power distribution networks (PDNs)
• Signal and thermal integrity
• D interconnects, 3D packages, TSVs and MCMs
• Electronic packages and microsystems
• RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches
• Nano interconnects and nano structures
• Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows
• Package-chip co-design
• Advanced and parallel CAD techniques for signal, power and thermal integrity analysis
• Macromodeling and model order reduction as it applies to electrical analysis
• Measurement and data analysis techniques for system-level and on-chip structures