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IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2013)

Upcoming Event (2014)



December 12-15, 2013(Ended)

Todai-ji Culture Centre
Nara, Japan

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2013)

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2013) was held in Nara, Japan on December 12-15, 2013.

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2013) covers topics such as: Testing on 3DIC and SiP DIC...
Address
Japan, Nara Prefecture, Nara, Zoshicho,
Nara,
Japan
Prices *
150-600 US Dollar
Exhibition
Included
Abstract submission deadline
June 25, 2013
Organization
Shizuoka University, IEEE

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