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IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016)

December 14-16, 2016

Sheraton Waikiki
Honolulu, HI, United States

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016)

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016) will be held in Honolulu, HI, United States on December 14-16, 2016.

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016) covers topics such as:

  • Testing on 3DIC and SiP
  • DIC / 3D-Stacked IC
  • Power Integrity / Ground Noise
  • Substrate Technology
  • SiP/SoP
  • Time/Frequency Domain Measurement Techniques
  • Electromagnetic Compatibility (EMC)
  • Embedded Device Substrate
  • Package Reliability
  • Design and Modeling for High-speed Channels and Interconnects
  • Advanced Simulation Tools and CAD
  • RF/mmW Circuit Package
  • Signal Integrity

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016) brings together world class designers and researchers.

2255 Kalakaua Av.,
Honolulu,
Hawaii,
United States
150-600 US Dollar
Included
August 15, 2016