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IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016)

December 2016 (Not Final)

Location is not final

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016)

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016) will be held in December 2016 (Not Final).

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016) covers topics such as:

  • Testing on 3DIC and SiP
  • DIC / 3D-Stacked IC
  • Power Integrity / Ground Noise
  • Substrate Technology
  • SiP/SoP
  • Time/Frequency Domain Measurement Techniques
  • Electromagnetic Compatibility (EMC)
  • Embedded Device Substrate
  • Package Reliability
  • Design and Modeling for High-speed Channels and Interconnects
  • Advanced Simulation Tools and CAD
  • RF/mmW Circuit Package
  • Signal Integrity

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2016) brings together world class designers and researchers.

150-600 US Dollar
Included
Shizuoka University, IEEE

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