The 26th Electronics Packaging Technology Conference (EPTC 2024) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.
The 26th Electronics Packaging Technology Conference (EPTC 2024) covers topics such as:
- TSV/Wafer Level Packaging
- Advanced Packaging
- Emerging Technologies
- Interconnection Technologies
- Assembly and Manufacturing Technology
- Materials and Processing
- Mechanical Simulation & Characterization
- Electrical Simulation & Characterization
- Quality, Reliability & Failure Analysis
- Thermal Characterization & Cooling Solutions
- Smart Manufacturing and Equipment Technology
- Photonics, Optoelectronics and Displays
The 26th Electronics Packaging Technology Conference (EPTC 2024) might be held in Dec 2024.
