Bondexpo - International trade fair for bonding technology

  • 08-11 Oct 2024
  • Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany

Description

Bondexpo - International trade fair for bonding technology is a trade fair for industrial bonding technology. It includes bonding, encapsulation, sealing, foam and insulating materials and relevant equipment.

Venue

  • Messe Stuttgart (Trade Fair Centre Stuttgart Airport) , Messepiazza 1, Stuttgart, Germany

More Details

Prices:
15-40 Euro (Estimated)
Exhibition:
Included
Organizer:
P. E. Schall GmbH & Co. KG
Website:

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Important

Please, check "Bondexpo - International trade fair for bonding technology" official website for possible changes, before making any traveling arrangements

Event Categories

Industry: Metal/Steel
Technology: Equipment & machinery, Industrial technology, Materials

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