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IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2017)

December 14-16, 2017   Zhejiang University, Hangzhou, China (Past)

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2017) was held in Hangzhou, China on December 14-16, 2017.

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2017) covers topics such as: Testing on 3DIC and SiP DIC...

Venue (View Map)

Zhejiang University
(library of the international campus)
388 Yuhangtang Road ,
Hangzhou,
China
200-495 US Dollar   (Early registration date: November 15, 2017)
Included
September 21, 2017

Important

Please, check the official conference website for possible changes, before you make any traveling arrangements

Prices are for evaluation only.

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