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IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2018)

December 16-18, 2018
Taj Chandigarh
(Past)

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2018) was held in Chandigarh, India on December 16-18, 2018.

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2018) covers topics such as: Testing on 3DIC and SiP DIC...

Venue (View Map)

Taj Chandigarh
Block No. 9, Sector 17-A,
Chandigarh,
India
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200-495 US Dollar
Included

Important

Please, check the official conference website for possible changes, before you make any traveling arrangements

Prices are for evaluation only.

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