Bondexpo - International trade fair for bonding technology is a trade fair for industrial bonding technology. It includes bonding, encapsulation, sealing, foam and insulating materials and relevant equipment.
Bondexpo - International trade fair for bonding technology might be held in Stuttgart, Germany in 04-10 Oct 2021.
Please, check the official conference website for possible changes, before you make any traveling arrangements
Prices are for evaluation only.