Bondexpo - International trade fair for bonding technology

  • 05-08 Oct 2020
  • Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany

Description

Bondexpo - International trade fair for bonding technology is a trade fair for industrial bonding technology. It includes bonding, encapsulation, sealing, foam and insulating materials and relevant equipment.

Bondexpo - International trade fair for bonding technology might be held in Stuttgart, Germany in 05-08 Oct 2020.

Venue

Messe Stuttgart (Trade Fair Centre Stuttgart Airport)
Messepiazza 1,
Stuttgart,
Germany
View Hotels near Venue
Free cancellation available

More Details

Prices:
15-40 Euro
Exhibition:
Included
Organizer:
P. E. Schall GmbH & Co. KG
Website:

Future Events

  • Bondexpo - International trade fair for bonding technology - 05-08 Oct 2020, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Stuttgart, Germany (16726)
  • Bondexpo - International trade fair for bonding technology - 04-10 Oct 2021, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Stuttgart, Germany (26181)

Past Events

  • Bondexpo 2019 - 07-10 Oct 2019, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Stuttgart, Germany (15398)
  • Bondexpo 2018 - 08-11 Oct 2018, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Stuttgart, Germany (4673)

Important

Please, check the official conference website for possible changes, before you make any traveling arrangements

Prices are for evaluation only.

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