ICP - Packaging Technologies for IC Devices is an Exhibition Featuring Various Products and Technologies for Semiconductors, Sensor Modules and LED Packaging.
ICP - Packaging Technologies for IC Devices presents products and services such as:
Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices
Various IC Packages
Substrate, Materials for Substrate, Various Software
Analysis / Simulation Software for IC Packaging
Semiconductor Device Inspection & Testing Zone
Gathering World`s TOP companies specialised in IC design, assembly and testing services!
Packaging Materials / Components
SATS / Contract Design Services Zone
Plating Materials / Chemicals / Equipment
Plating / Etching Zone
ICP - Packaging Technologies for IC Devices brings together Sensor Manufacturers, Automotive Electronics Manufacturers, Set Manufacturers (in high-density SMT), Assembly Manufacturers/SATS, MEMS Devices/LED Manufacturers and Semiconductor Manufacturers.