IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2020)
- 14-16 Dec 2020
- Shenzhen, China
Description
The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2020) covers topics such as:
- Testing on 3DIC and SiP
- DIC / 3D-Stacked IC
- Power Integrity / Ground Noise
- Substrate Technology
- SiP/SoP
- Time/Frequency Domain Measurement Techniques
- Electromagnetic Compatibility (EMC)
- Embedded Device Substrate
- Package Reliability
- Design and Modeling for High-speed Channels and Interconnects
- Advanced Simulation Tools and CAD
- RF/mmW Circuit Package
- Signal Integrity
The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2020) brings together world class designers and researchers.
The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2020) will be held in Shenzhen, China on 14-16 Dec 2020.
Important
Please, check the official conference website for possible changes, before you make any traveling arrangements
Prices are for evaluation only.
