IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021)

Dec 2021 (TBD)
Location TBD

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Description

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) covers topics such as:

Testing on 3DIC and SiP
DIC / 3D-Stacked IC
Power Integrity / Ground Noise
Substrate Technology
SiP/SoP
Time/Frequency Domain Measurement Techniques
Electromagnetic Compatibility (EMC)
Embedded Device Substrate
Package Reliability
Design and Modeling for High-speed Channels and Interconnects
Advanced Simulation Tools and CAD
RF/mmW Circuit Package
Signal Integrity

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) brings together world class designers and researchers.

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) might be held in Dec 2021 (TBD).

More Details

Prices:

200-495 US Dollar

Exhibition:

Included

Organizer:

IEEE

Website:

Prices are for evaluation only.

Future Events

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) - Dec 2021, Location TBD (16295)

Past Events

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2020) - 14-16 Dec 2020, Shenzhen, China (314)
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2019) - 16-18 Dec 2019, Grand Hi-Lai Hotel, Kao-hsiung, Taiwan (32316)

Important

Please, check the official event website for possible changes, before making any traveling arrangements

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