IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021)

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) covers topics such as:

• Testing on 3DIC and SiP
• DIC / 3D-Stacked IC
• Power Integrity / Ground Noise
• Substrate Technology
• SiP/SoP
• Time/Frequency Domain Measurement Techniques
• Electromagnetic Compatibility (EMC)
• Embedded Device Substrate
• Package Reliability
• Design and Modeling for High-speed Channels and Interconnects
• Advanced Simulation Tools and CAD
• RF/mmW Circuit Package
• Signal Integrity

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) brings together world class designers and researchers.

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) might be held in Dec 2021 (TBD).