IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022)

Dec 2022

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Description

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022) covers topics such as:

Testing on 3DIC and SiP
DIC / 3D-Stacked IC
Power Integrity / Ground Noise
Substrate Technology
SiP/SoP
Time/Frequency Domain Measurement Techniques
Electromagnetic Compatibility (EMC)
Embedded Device Substrate
Package Reliability
Design and Modeling for High-speed Channels and Interconnects
Advanced Simulation Tools and CAD
RF/mmW Circuit Package
Signal Integrity

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022) brings together world class designers and researchers.

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022) might be held in Dec 2022.

More Details

Prices:

200-495 US Dollar (Estimated)

Exhibition:

Included

Organizer:

IEEE

Website:

Abstract submission deadline: 15 Oct 2021

Future Events

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022) - Dec 2022, (32316)

Past Events

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) - 13-15 Dec 2021, Online Event (16295)
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2020) - 14-16 Dec 2020, Shenzhen, China (314)

Important

Please, check the official event website for possible changes, before making any traveling arrangements

Event Categories

Industry: Electronics & Electrical

Science: Engineering

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