IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022)

  • Dec 2022

Description

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022) covers topics such as:

  • Testing on 3DIC and SiP
  • DIC / 3D-Stacked IC
  • Power Integrity / Ground Noise
  • Substrate Technology
  • SiP/SoP
  • Time/Frequency Domain Measurement Techniques
  • Electromagnetic Compatibility (EMC)
  • Embedded Device Substrate
  • Package Reliability
  • Design and Modeling for High-speed Channels and Interconnects
  • Advanced Simulation Tools and CAD
  • RF/mmW Circuit Package
  • Signal Integrity

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022) brings together world class designers and researchers.

The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022) might be held in Dec 2022.

More Details

Prices:
200-495 US Dollar (Estimated)
Exhibition:
Included
Organizer:
IEEE
Website:
Abstract submission deadline: 15 Oct 2021

Future Events

  • IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2022) - Dec 2022, (32316)

Past Events

  • IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2021) - 13-15 Dec 2021, Online Event (16295)
  • IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2020) - 14-16 Dec 2020, Shenzhen, China (314)

Important

Please, check the official event website for possible changes, before making any traveling arrangements

Event Categories

Industry: Electronics & Electrical
Science: Engineering

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