IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2019)
16-18 December 2019
Grand Hi-Lai Hotel, Kao-hsiung
The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2019) will be held in Kao-hsiung, Taiwan on 16-18 December 2019.
The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2019) covers topics such as:
- Testing on 3DIC and SiP
- DIC / 3D-Stacked IC
- Power Integrity / Ground Noise
- Substrate Technology
- SiP/SoP
- Time/Frequency Domain Measurement Techniques
- Electromagnetic Compatibility (EMC)
- Embedded Device Substrate
- Package Reliability
- Design and Modeling for High-speed Channels and Interconnects
- Advanced Simulation Tools and CAD
- RF/mmW Circuit Package
- Signal Integrity
The IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2019) brings together world class designers and researchers.
Important
Please, check the official conference website for possible changes, before you make any traveling arrangements
Prices are for evaluation only.