32nd IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2020)

  • 17-21 May 2020
  • Hofburg Vienna, Austria

The 32nd IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2020)is dedicated to integrated power and ICs, power devices and power packaging.

The 32nd IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2020) covers topics such as:

  • Processes
    Doping Technology, Process Integration, Passivation, Lifetime Control and Crystal Growth
  • Devices
    Device Design, Device Physics, High Power Devices, High Frequency Devices, RF Power Devices, Smart Power Devices, Reliability, Safe-Operating Area and ESD
  • Materials
    GaAs, Si, GaN, SiC and Diamond
  • Modeling/Simulation: Circuit Simulation, Device, Verification Tools and Layout
  • Packaging
    Power SiP, Novel Packaging Concepts, Thermal Analysis, Stress and Thermal Management
  • Power ICs
    SOI, Isolation Techniques, Device Technology, Circuit Design, SOA, Energy Capability, ESD, Reliability, Monolithic vs Hybrid and Power SoC
  • Applications
    Computer, Hybrid Vehicles, Motor Drives, Telecom Power and Utility

The 32nd IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2020) will be held in Vienna, Austria on 17-21 May 2020.

Venue

Hofburg Vienna
Heldenplatz,
Vienna,
Austria
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Booking.com
150-800 Euro
IEEE
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Past and Future Events

  • 33rd IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2021) - May 2021 (27115)
  • 32nd IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2020) - 17-21 May 2020, Vienna, Austria (13484)
  • 31st IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2019) - 19-23 May 2019, Shanghai, China (27116)

Important

Please, check the official conference website for possible changes, before you make any traveling arrangements

Prices are for evaluation only.

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