Description
Conference Scope: Design: SOC/SIP; Multiprocessor; Embedded systems; Wireless; NoC; Analog/Mixed Signal/ RF; MEMS/ MOEMS; Low Voltage/Low Power; Innovative technologies; Synthesis; Simulation/Validation/Verification. Technology: Device modeling; Material characterization; Failure analysis; Packaging; Process technology; Reliability. Testing: Defect/fault modeling; Analog/Mixed Signal; MEMS/MOEMS; SOC/SIP; Delay; Memory; Fault Simulation, ATPG; DFT, BIST/BISR; On-line testing/fault tolerant; ATE.
