The International Conference on Integrated Power Electronics Systems (CIPS 2020) covers topics such as:
Application of integrated PE systems Drivers, Inverters and converters and Advanced filters
Mechatronic systems Integration of PE into E-machine, Integration of sensors and actuators and Overall system optimization
Packaging New materials and interconnects, System and component packaging, Assembly concepts, Cooling concepts, High and low temperature applications, Embedded power and Interface materials
High and medium power modules Intelligent power modules and Advanced module concepts
Reliability Application dependent mission profiles, Reliability requirements, Prognostics and health management, Physics of failure, Robustness validation process and Intelligent testing
Components Sensors and actuators, New and integrated active and passive components and Wide bandgap integration concepts
Design and Test Tools Thermal design and management, Electrical design: Internal parasitic and interferences (EMI), Physical models for failure mechanisms, Multi-physics CAD and Calibration experiments
The International Conference on Integrated Power Electronics Systems (CIPS 2020) brings together engineers coming from academia and industry involved in Component development, System development, Research and Reliability engineering.
The International Conference on Integrated Power Electronics Systems (CIPS 2020) will be held in Berlin, Germany on 24-26 Mar 2020.