InterPACK & ICNMM - The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and The International Conference on Nanochannels, Microchannels and Minichannels

InterPACK & ICNMM - The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and The International Conference on Nanochannels, Microchannels and Minichannels covers topics such as:

  • Emerging Technology Frontiers
  • Advanced Electronics and Photonics: Packaging, Interconnect and Reliability
  • Thermal Management
  • MEMS and NEMS
  • Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
  • Thermal Management Using Micro Channels, Jets, Sprays
  • Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices
  • Advanced Fabrication and Manufacturing
  • Technology Update Talks
  • Panels
  • Student Poster and Networking Session
  • Mini Workshops and Tutorials
  • Advanced Electronics and Photonics, Packaging Materials and Processing
  • Exhibits, Vendors, and Sponsors (Technical Presentation)

InterPACK & ICNMM - The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and The International Conference on Nanochannels, Microchannels and Minichannels brings together researchers and practitioners from academia, industry, and government.

Important

Please, check the official conference website for possible changes, before you make any traveling arrangements

Prices are for evaluation only.

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