International Conference on Electronics, Mechanical Engineering and Computer Science (EMECS 2022)

The International Conference on Electronics, Mechanical Engineering and Computer Science (EMECS 2022) covers topics such as:

• Substrate Embedding & Advanced Flip-Chip Packaging
• 3D Process and Integration Technologies
• Design and Analysis of Power Delivery Systems
• Wafer-Level CSP & Heterogeneous Integration
• Wearable, Flexible, and Stretchable Electronics
• Novel Materials, Devices and 3D Interconnects
• Digital System and Logic Design
• Optical Interconnects & 3D Photonics
• Networked-Driven Multicore Chips
• Computer Architecture and VLSI
• Electrical Machines
• Advance Robotics Systems
• Signals and Systems
• Analog and Digital Electronics
• Automation
• Applied Mechanics
• Computational Fluid Dynamics
• Biomechanics
• Fuels and Combustion
• Fluid Dynamics
• Industrial Tribology
• Heat and Mass Transfer
• Mechatronics
• Robotics
• Optimization of Systems
• Nano- Technology
• Solid Mechanics
• Renewable and Non-Renewable Energies
• Energy Systems
• Oil and Gas
• Experimental Techniques and Measurements
• MEMS and Nanotechnology
• Structures and Materials
• Dynamics and Controls
• Algorithms
• Thermo-fluid
• Big Data
• Artificial Intelligence and Machine Learning
• Biomedical Informatics and Computation
• Blockchain Technology
• Data Compression
• Computer Architecture
• Image Processing
• High-Performance Computing
• Knowledge Discovery and Data Mining
• Parallel and Distributing Computing
• Wireless and Sensor Devices
• Virtual Reality and Visualization