35th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2026)

The 35th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2026) focuses on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems, showcasing new methods for signal integrity, power integrity, high-speed interconnects, and system-level optimization across RF, wireless, and quantum applications.

Key Topics

• Interconnects design & technologies
• High-speed channels, backplanes, SerDes, memory, and DDR interfaces
• Signal & power integrity issues
• Jitter and noise analysis in high-speed systems
• High-frequency interconnects, packages, and antennas-in-package
• Novel and unconventional interconnect technologies
• Manufacturing, testing, and reliability
• Measurement techniques for electronic systems
• Packaging and integration
• Quantum systems: interconnection and packaging aspects
• Modeling and simulation

Who should attend

• Electrical and electronic packaging engineers
• Researchers in high-speed and RF system design
• Signal integrity and power integrity specialists
• Professionals in modeling, simulation, and CAD tools
• Manufacturing, testing, and reliability engineers
• Experts in quantum systems interconnection and packaging