ITHERM 2027 - The 26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ITHERM 2027 - The 26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems is a scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

Key Topics

• Mechanics
  
  • Failure Mechanics and Damage Modeling
  • Modeling and Simulation for Reliability at Board, Package and System Levels
  • Constitutive Models
  • Experimental Techniques
  • Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
  • Drop, Impact and Vibrational Analysis of Packages, Sub-Systems, and Systems
  • Materials: Design, Synthesis and Processing of Materials for Thermal/Thermo-Mechanical Management in Electronic Systems Thermo-mechanical Characterization and Modeling of Packaging Materials Material Interfaces: Engineering, Characterization and Simulation
• Thermal Management
  
  • Natural and Forced Convection Air Cooling
  • Novel Materials: Heat Spreaders, Thermal Vias and Thermal Interface Materials
  • Single Phase Liquid Cooling
  • Advances in Compact Air Movers
  • Microfabricated Thermal Management Devices and Systems
  • Novel Phase Change Cooling Techniques: Heat Pipes, Boiling, Spray, Thermosyphon and Jet Impingement
  • Thermal Management in Networking, Wireless, Lighting, Computing, Peripheral Hardware and Harsh Environments
  • Sub-Ambient Cooling: Vapor Compression, Solid State, Adsorption, Absorption, Magnetocaloric and Thermo-acoustic
  • Three-Dimensional Electronics
  • Thermal and Energy Management in Data Centers
  • Advances in Computational Characterization: Compact Modeling, Multi-Scale Modeling, Multi-Objective Design, Multi-Physics Modeling and Optimization
  • Advances in Experimental Characterization
• Emerging Technologies
  
  • Nanotechnology: Mechanics, Thermal, Process and Material Related Issues in Nanostructures
  • Sensors (Military, Medical, Structures, Consumer and Diagnostic...)
  • Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
  • Micro-Fluidics
  • Integrated Biochips and Bioelectronics
  • MEMS: Device and Package Level Reliability Issues
  • Space Systems: Earth Orbiting and Deep-Space Missions
  • Medical, Telecommunication, and Automotive Systems