The 4th Asia Conference on Electronics Engineering (ACEE 2027) explores advanced electronic technologies, semiconductor devices, integrated circuit design, intelligent sensing, quantum computing, and AI applications in electronic systems.
Key Topics
Microelectronics and nanoelectronic devices
Advanced semiconductor materials and devices, including SiC, GaN, and 2D materials
Power electronics and wide-bandgap power devices
Flexible electronics and wearable devices
Gallium oxide and 2D material heterojunction devices
Quantum dot and bio-inspired electronic devices
Integrated circuit design and manufacturing
VLSI, system-on-a-chip (SoC), ASIC, and chiplet design
Analog, digital, and mixed-signal integrated circuits
RFIC and millimeter-wave circuits
AI accelerator chips and 3D integrated circuit stacking
Terahertz and low-power integrated circuit design
Design for manufacturability (DFM)
Optoelectronics and image sensing
Optoelectronic devices and silicon photonics
CMOS image sensors and multispectral imaging
3D imaging and LiDAR
Medical imaging and biomedical sensing
Quantum dot image sensors and terahertz imaging
AI-enabled image sensors and flexible optoelectronic displays
Electromagnetic technologies and communication devices
RF, microwave, and millimeter-wave communication devices
Antenna design and electromagnetic compatibility (EMC)
Wireless communication integrated circuits
Terahertz communication devices and systems
Reconfigurable intelligent surface (RIS) devices
5G/6G RF front-end devices and electromagnetic metamaterials
Medical electronics and biomedical devices
Electronic systems for medical imaging equipment
Biomedical sensors and portable medical electronics
Implantable and biodegradable electronic devices
AI-assisted diagnostic systems
Telemedicine monitoring systems
Neural interface technologies
Embedded systems and control technologies
Embedded systems and real-time control
Robust and adaptive control
Modeling, system identification, and process optimization
FPGA and reconfigurable computing
Embedded AI and edge computing systems
Automotive embedded control and embedded system security
Intelligent sensing and MEMS technologies
MEMS/NEMS sensors and microsensing systems
Smart sensors and multisensor fusion
Environmental and industrial sensing
Energy harvesting and low-power sensing
Bio-inspired and flexible MEMS devices
Quantum sensing, sensor networks, and IoT integration
Quantum electronics and quantum computing
Quantum computing and quantum electronic devices
Quantum sensing and communication systems
Superconducting and topological quantum devices
Quantum dot quantum computing
Quantum-classical hybrid computing
Quantum error correction technologies
Electronic system security and AI applications
Dependable computing and computer security
AI and machine learning in electronic engineering
Neuromorphic chips and brain-inspired computing
Big data analysis for electronic engineering
Hardware security and side-channel attack defense
Generative AI in electronic design
AI-driven fault diagnosis and federated learning
Who should attend
Electronic engineering researchers and academics
Semiconductor and microelectronics engineers
Integrated circuit designers and manufacturing specialists
Optoelectronics and image sensing researchers
Communication device and electromagnetic design engineers
Biomedical electronics and medical device developers
Embedded systems and control engineers
MEMS, NEMS, and intelligent sensing specialists
Quantum computing and quantum electronics researchers
AI, hardware security, and electronic system computing specialists
