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Bondexpo - International trade fair for bonding technology

Oct 2027
Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany
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Venue

Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Messepiazza 1, Stuttgart, Germany

More Details

Prices:
15-40 Euro (Estimated)
Exhibition:
Included
Organizer:
P. E. Schall GmbH & Co. KG
Website:
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Future Events

Bondexpo - International trade fair for bonding technology - Oct 2027, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany (15398)

Past Events

Bondexpo - International trade fair for bonding technology - 06-08 Oct 2026, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany (4673)
Bondexpo - International trade fair for bonding technology - 07-09 Oct 2025, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany (26181)
Bondexpo - International trade fair for bonding technology - 08-11 Oct 2024, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany (16726)

Important

Please, check "Bondexpo - International trade fair for bonding technology" official website for possible changes, before making any traveling arrangements

Event Categories

Industry: Metal/Steel
Technology: Equipment & machinery, Industrial technology, Materials

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