Bondexpo - International trade fair for bonding technology

  • 04-07 Oct 2022
  • Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany

Description

Bondexpo - International trade fair for bonding technology is a trade fair for industrial bonding technology. It includes bonding, encapsulation, sealing, foam and insulating materials and relevant equipment.

Bondexpo - International trade fair for bonding technology will be held in Stuttgart on 04-07 October 2022.

Venue

  • Messe Stuttgart (Trade Fair Centre Stuttgart Airport) , Messepiazza 1, Stuttgart, Germany

More Details

Prices:
15-40 Euro (Estimated)
Exhibition:
Included
Organizer:
P. E. Schall GmbH & Co. KG
Website:

Future Events

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Important

Please, check the official event website for possible changes, before making any traveling arrangements

Event Categories

Industry: Metal/Steel
Technology: Equipment & machinery, Industrial technology, Materials

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