22nd Electronics Packaging Technology Conference (EPTC 2020)

The 22nd Electronics Packaging Technology Conference (EPTC 2020) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.

The 22nd Electronics Packaging Technology Conference (EPTC 2020) covers topics such as:

• Wafer Level Packaging 
  D integration, Wafer level packaging (Fan-in, Fan-out), Silicon interposer and Through Silicon Via
• Advanced Packaging
  Wire-bond packaging, Flip chip packaging, D System in Packaging and Embedded passives & actives on substrates
• Emerging Technologies
  Biomedical, Packaging technologies for MEMS, Photo voltaic, Optoelectronics, Wearable electronics and Printed electronics...
• Interconnection Technologies
  Solder bump technology, Wire bonding technology, TSV, solder alternatives (ACP, ICP, NCP and ACF)
• Electrical Modeling & Simulations
  signal integrity analysis of substrate/package and Power plane modeling
• Materials & Processes
  D packages, processes and Materials for traditional and advanced microelectronic systems, solar, MEMS, green and biomedical packaging
• Thermal Characterization and Cooling Solutions
  system and component level thermal management and characterization, Thermal modeling and simulation
• Mechanical Modeling & Simulations
  solder/metal fatigue, Thermo-mechanical / Structural / Moisture modeling, drop impact and vibration...
• Wafer/Package Testing and Characterization
  test methodologies, High-speed test systems and architectures and probe card design
• Quality & Reliability
  interfacial adhesion, board, Component and system level reliability assessment, failure characterization and accelerated testing...

The 22nd Electronics Packaging Technology Conference (EPTC 2020) will be held in Singapore on 02-04 Dec 2020.