22nd Electronics Packaging Technology Conference (EPTC 2020)

The 22nd Electronics Packaging Technology Conference (EPTC 2020) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.

The 22nd Electronics Packaging Technology Conference (EPTC 2020) covers topics such as:

• Wafer Level Packaging 
  D integration, Wafer level packaging (Fan-in, Fan-out), Silicon interposer and Through Silicon Via
• Advanced Packaging
  Wire-bond packaging, Flip chip packaging, D System in Packaging and Embedded passives & actives on substrates
• Emerging Technologies
  Biomedical, Packaging technologies for MEMS, Photo voltaic, Optoelectronics, Wearable electronics and Printed electronics...
• Interconnection Technologies
  Solder bump technology, Wire bonding technology, TSV, solder alternatives (ACP, ICP, NCP and ACF)
• Electrical Modeling & Simulations
  signal integrity analysis of substrate/package and Power plane modeling
• Materials & Processes
  D packages, processes and Materials for traditional and advanced microelectronic systems, solar, MEMS, green and biomedical packaging
• Thermal Characterization and Cooling Solutions
  system and component level thermal management and characterization, Thermal modeling and simulation
• Mechanical Modeling & Simulations
  solder/metal fatigue, Thermo-mechanical / Structural / Moisture modeling, drop impact and vibration...
• Wafer/Package Testing and Characterization
  test methodologies, High-speed test systems and architectures and probe card design
• Quality & Reliability
  interfacial adhesion, board, Component and system level reliability assessment, failure characterization and accelerated testing...

The 22nd Electronics Packaging Technology Conference (EPTC 2020) might be held in Singapore in 2020 (Not Final).