ITHERM 2020 - The 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

  • May 2020 (Not Final)
  • United States

ITHERM 2020 - The 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems is a scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITHERM 2020 - The 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems covers topics such as:

  • Mechanics
    • Failure Mechanics and Damage Modeling
    • Modeling and Simulation for Reliability at Board, Package and System Levels
    • Constitutive Models
    • Experimental Techniques
    • Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
    • Drop, Impact and Vibrational Analysis of Packages, Sub-Systems, and Systems
    • Materials: Design, Synthesis and Processing of Materials for Thermal/Thermo-Mechanical Management in Electronic Systems Thermo-mechanical Characterization and Modeling of Packaging Materials Material Interfaces: Engineering, Characterization and Simulation
  • Thermal Management
    • Natural and Forced Convection Air Cooling
    • Novel Materials: Heat Spreaders, Thermal Vias and Thermal Interface Materials
    • Single Phase Liquid Cooling
    • Advances in Compact Air Movers
    • Microfabricated Thermal Management Devices and Systems
    • Novel Phase Change Cooling Techniques: Heat Pipes, Boiling, Spray, Thermosyphon and Jet Impingement
    • Thermal Management in Networking, Wireless, Lighting, Computing, Peripheral Hardware and Harsh Environments
    • Sub-Ambient Cooling: Vapor Compression, Solid State, Adsorption, Absorption, Magnetocaloric and Thermo-acoustic
    • Three-Dimensional Electronics
    • Thermal and Energy Management in Data Centers
    • Advances in Computational Characterization: Compact Modeling, Multi-Scale Modeling, Multi-Objective Design, Multi-Physics Modeling and Optimization
    • Advances in Experimental Characterization
  • Emerging Technologies
    • Nanotechnology: Mechanics, Thermal, Process and Material Related Issues in Nanostructures
    • Sensors (Military, Medical, Structures, Consumer and Diagnostic...)
    • Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
    • Micro-Fluidics
    • Integrated Biochips and Bioelectronics
    • MEMS: Device and Package Level Reliability Issues
    • Space Systems: Earth Orbiting and Deep-Space Missions
    • Medical, Telecommunication, and Automotive Systems

ITHERM 2020 - The 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems might be held in United States in May 2020 (Not Final).

175-1100 US Dollar
Included
Sponsored by Components, Packaging and Manufacturing Technology Society - CPMT, IEEE
Rentalcars Savings

Past and Future Events

  • ITHERM 2020 - The 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - May 2020, United States (26813)
  • ITHERM 2018 - The 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - 29 May - 1 Jun, 2018, San Diego, United States (26812)
  • ITHERM 2016 - The 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - 31 May - 3 Jun, 2016, Las Vegas, United States (802)

Important

Please, check the official conference website for possible changes, before you make any traveling arrangements

Prices are for evaluation only.

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