IC Packaging Fair 2025 focuses on fostering innovation and business connections in the advanced packaging industry by integrating IC design, packaging, and testing with manufacturing services.
Product & Service Categories
Automatic test equipment ATE
Wafer thinning machines
Microwave/plasma cleaning machines
Plating equipment
Metal wires
Probe stations
Adhesive films
Film stripping machines
Injection molding machines
Annealing furnaces
AOI testing equipment
Lead frames
Thickness/roughness measuring machines
Wafer mounting machines
Scribing solutions
Epoxy resins
Who should Attend
OEM/EMS manufacturers
Automotive electronics professionals
IC design companies
Semiconductor packaging and testing factories
Electronic product design solution providers
Military electronics specialists
Medical electronics professionals
5G and IoT technology developers
Electronic brand OBMs
Wireless communication experts
Display chip and module manufacturers
Past Events
IC Packaging Fair 2025 - 28-30 Oct 2025, Shenzhen World Exhibition & Convention Center, China (105769)
IC Packaging Fair 2026
Important
Please, check "IC Packaging Fair" official website for possible changes, before making any traveling arrangements
