The 11th International Conference on Material Engineering and Manufacturing (ICMEM 2027) brings together innovations and research in materials engineering, advanced manufacturing technologies, and automation systems.
Key Topics
Graphene and its applications
Lean and agile manufacturing
Mechatronics
Manufacturing processes and technology
Automation
Nanomaterials
Hypersurfaces and their applications
Intelligent surfaces and reconfigurable intelligent surfaces
Virtual instrumentation in automation
Advanced manufacturing technology
Machine vision system
Advanced design technology
Manufacturing systems and equipment
Materials characterization
Controllers and distributed control system
Computer aided metrology
Materials science
Materials science and engineering
Industrial automation and process control
Surface modification technologies
Cellular manufacturing
Vibration engineering
Embedded system
Automation, control and information technology
Composites
Industrial robots and automation
Metamaterials and metasurfaces
Nano fabrication and precision engineering
Intelligent controllers
Manufacturing engineering
Manufacturing system and simulation
Who should Attend
Automation specialists
Materials scientists
Robotics engineers
Manufacturing system analysts
Mechanical engineers
Nanotechnology researchers
Process control engineers
Academic researchers
Venue
Osaka International Convention Center, 5-3-51 Nakanoshima, Kita-ku, Osaka, Japan
11th International Conference on Material Engineering and Manufacturing (ICMEM 2027) - 28-31 Mar 2027, Osaka International Convention Center, Japan (72795)
12th International Conference on Material Engineering and Manufacturing (ICMEM 2028) - Mar 2028, Japan (72796)
Past Events
10th International Conference on Material Engineering and Manufacturing (ICMEM 2026) - 27-31 Mar 2026, Kyoto University of Advanced Science (Uzumasa Campus), Japan (67045)
Important
Please, check "International Conference on Material Engineering and Manufacturing (ICMEM)" official website for possible changes, before making any traveling arrangements