14th International Symposium on Industrial Embedded Systems (SIES 2024)

  • 23-25 Oct 2024
  • Chengdu Xiangyu Hotel, China

Description

The 14th International Symposium on Industrial Embedded Systems (SIES 2024) covers topics such as:

  • System-on-chip and network-on-chip design & testing
    • Design and programming of embedded multiprocessors
    • Design of application-specific instruction-set processors
    • Risc-v and open hardware
    • Soc communication and architectures
    • Design of soc/noc
    • Noc communication and architectures
    • Reconfigurable platforms
    • Platform-based design for embedded systems
    • Testing of embedded core-based integrated circuits
    • Multiprocessor soc platforms and tools
    • Hardware security
  • Embedded systems
    • Real-time systems
    • Design and validation of embedded systems
    • Models of embedded computation
    • Real-time artificial intelligence and machine learning
    • Operating systems and scheduling
    • Design and verification languages
    • Design space exploration
    • Timing and performance analysis
    • Qos mechanisms for virtualization
    • Virtualization technologies
    • Fault tolerance & dependability adaptive embedded systems
    • Energy and power aware embedded computing
    • Cyber-security for embedded systems
  • Embedded applications
    • Automotive applications and autonomous driving
    • Cyber-physical systems and internet of things, including industrial automation and controls
    • Smart home
    • Intelligent transportation systems
    • Industrial building automation and control
    • Wireless health care
    • Real-time edge computing use cases
  • Networked embedded systems and edge computing
    • Middleware frameworks
    • Design issues for networked embedded
    • Resource scheduling and orchestration in distributed systems
    • AI at the edge
    • Time-sensitive networks and 5g/6g-enabled embedded systems
    • Self adaptive networked entity sensor networks
    • Methodologies for performance-aware functional decomposition between cloud and edge
    • End-to-end latency guarantees in the edge-to-cloud continuum
    • Safety, security, and real-time performance in distributed applications

Venue

  • Chengdu Xiangyu Hotel , 103, Xinnan Road, Shuangliu, Chengdu, China

More Details

Prices:
250-650 US Dollar (Estimated)
Exhibition:
No exhibition
Organizer:
International Symposium on Industrial Embedded Systems (SIES)
Website:
Abstract submission deadline: 30 Apr 2024

Future Events

Important

Please, check "International Symposium on Industrial Embedded Systems (SIES)" official website for possible changes, before making any traveling arrangements

Event Categories

Industry: Electronics & Electrical
Science: Computer Science
Technology: Computer Hardware, Industrial technology, Robotics

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