InterPACK & ICNMM 2015 - The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and The International Conference on Nanochannels, Microchannels and Minichannels
Advanced Electronics and Photonics: Packaging, Interconnect and Reliability
Thermal Management
MEMS and NEMS
Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
Thermal Management Using Micro Channels, Jets, Sprays
Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices
Advanced Fabrication and Manufacturing
Technology Update Talks
Panels
Student Poster and Networking Session
Mini Workshops and Tutorials
Advanced Electronics and Photonics, Packaging Materials and Processing
Exhibits, Vendors, and Sponsors (Technical Presentation)
Who should Attend
Researchers and practitioners from academia, industry, and government.
Past Events
InterPACK & ICNMM 2015 - The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and The International Conference on Nanochannels, Microchannels and Minichannels - 06-09 Jul 2015, Fairmont Hotel San Francisco, California, United States (52267)
InterPACK & ICNMM - The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and The International Conference on Nanochannels, Microchannels and Minichannels 2026
Important
Please, check "InterPACK & ICNMM - The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and The International Conference on Nanochannels, Microchannels and Minichannels" official website for possible changes, before making any traveling arrangements
Event Categories
Industry: Electronics & Electrical, Energy & Utilities, Packaging
