ICMESP 2022: International Conference on Microelectronic Engineering and Semiconductor Physics

  • 07-08 Jan 2022
  • Tokyo, Japan

Description

ICMESP 2022: International Conference on Microelectronic Engineering and Semiconductor Physics covers topics such as:

  • Semiconductors for microelectronics and photonics
  • Microelectronics, electromagnetics and photonics
  • Microelectronics, photonics and nanotechnology
  • Microelectronics and photonics
  • Engineered materials
  • Photonics, micro-electronics, and materials
  • Microelectronics
  • Micro- and nanotechnology
  • Photonics
  • Microelectronics
  • Micro-/nano-engineering / fabrication / technology / manufacturing
  • Microelectronics processing and materials
  • Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication
  • Nanoelectronic and photonic devices and their fabrication
  • Nanolithography and nanopatterning
  • Microfluidics, life science devices /sensors, as well as integrated lab-on-a-chip and their fabrication
  • Electron optical methods and systems
  • Optical lithography
  • Resists
  • X-ray optical methods and systems
  • Nanoimprint lithography
  • Limits of nanolithography
  • Charged particle based lithography and patterning
  • Euv lithography and masks
  • Maskless lithography
  • Nanoimprint lithography techniques and templates
  • Limits of nanopatterning
  • Emerging nanopatterning methods
  • Ion technology
  • Pattern transfer
  • Transfer of pattern with other methods
  • Plasma processing
  • Plasma nanotechnology
  • Plasma etching
  • Plasma surface modification of devices
  • Plasma / beam nanopatterning
  • Materials
  • Wet transfer methods
  • Silicon on insulators
  • Metallization and barrier materials
  • Interconnects
  • Dielectrics (low k and high k)
  • Nanomaterials for device fabrication
  • New resist materials
  • Polymers and flexible substrates
  • Block copolymers
  • Nanometrology, inspection and testing
  • Layered (2d) materials and related transferring techniques
  • Laser probes
  • Electron beam testers
  • Nanometrology
  • Signal and image processing
  • Advanced processing and nanofabrication
  • Afm and scanning probe measurements
  • Three dimensional integration
  • Process integration
  • 3d printing
  • Other / emerging manufacturing and fabrication techniques
  • Process modelling and simulation
  • Rapid thermal processing
  • Laser assisted processing
  • Equipment modelling
  • Growth, planarization, cleaning techniques for devices
  • Top-down / bottom-up (self-assembly) nanofabrication
  • Mbe
  • Plasma deposition
  • Planarization and cleaning techniques
  • Other growth techniques
  • Nanoelectronic, optoelectronic and photonic devices
  • Advanced nanoelectronic, photonic, sensing, energy harvesting, and fluidic devices
  • Steep slope or fast switching devices
  • Memristive devices for neuromorphic computing
  • Optoelectronic devices
  • Photonic devices
  • Memory devices
  • Dimension-sensitive device properties
  • Advanced mos devices
  • Magnetic and spintronic devices
  • Flexible / organic / molecular electronics
  • Vacuum nanoelectronics
  • Flexible electronics
  • Organic and molecular electronics
  • Paper electronics
  • Wearable electronics
  • Microdevices, energy harvesting devices and sensors
  • Printed electronics
  • Energy harvesting devices
  • Physical sensors and actuators
  • Valving devices
  • Micro- and nanofluidics
  • Mixing devices
  • Pumping devices
  • Biosensors
  • Chemical sensors
  • Bioelectronic devices
  • Biomimetic properties incorporated into devices
  • Advanced fabrication and characterization for heterogeneous micro and nano systems
  • Micro / nano / bio interface and interconnection devices
  • Power mems
  • Electro-mechanical systems (mems, nems)
  • Moems
  • Rf mems
  • Optical and photonic systems
  • Magnetic mems
  • Pumping / valving systems
  • Fluidic systems
  • Fluidic interfaces and integration
  • Microreactors
  • Dna / protein chips
  • Biosystems
  • Organ on chip
  • Cell on chip
  • Lab-on-a-chip
  • Biomimetic properties incorporated into systems
  • Microseparation, pretreatment systems
  • Bioanalytic, diagnostic systems
  • Environmental and food monitoring systems
  • On-chip detection systems
  • Research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications
  • Separation devices
  • Other miniaturized devices for biology, chemistry, and medicine (sensors and biosensors)

ICMESP 2022: International Conference on Microelectronic Engineering and Semiconductor Physics will be held in Tokyo, Japan on 07-08 Jan 2022.

More Details

Prices:
250-500 Euro (Estimated)
Organizer:
WASET - World Academy of Science, Engineering and Technology
Website:

Future Events

  • ICMESP 2022: International Conference on Microelectronic Engineering and Semiconductor Physics - 07-08 Jan 2022, Tokyo, Japan (91728)
  • ICMESP 2023: International Conference on Microelectronic Engineering and Semiconductor Physics - 07-08 Jan 2023, Tokyo, Japan (60832)

Important

Please, check the official event website for possible changes, before making any traveling arrangements

Event Categories

Industry: Electronics & Electrical
Science: Engineering, Physics

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